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Back Silver Paste
Category:
Silver paste
Product Details
U-8820 PERC silver paste suits for rear passivation of polycrystal and monocrystal silicon, with the characteristics of good printing, low wet weight, good thermal ageing, reliable weldability and high adhesion. compatible with the main-stream front passivation silver paste and PERC aluminum paste, and wide co firing window, The paste conforms to ROHS environmental protection standard, lead and cadmium free.
Advantages
◆ Low wet weight, smal consumption
◆ Good wettability and solder wettability, suitable for all kinds of ribbon
◆ High adhesion, Firmly bonding with back side silicon nitride and non-corroding passivation layer.
◆ Good thermal aging performance (oven aging 1h under 150°C temperature,pull>2N)
◆ Low contact resistance (contact resistance between back silver paste and back aluminum paste), no powder drop in contact with back aluminum paste
◆ High efficiency
◆ Lead and cadmium free
Low wet weight
◆ Used for 156mmx1 56mm monocrystalline silicon wafer,u-8820p PERC silver paste can save 2%~5% paste for cus-tomers.
Good weldability
◆ Test conditions: solder with 63 sn37pb temperature 240 C, sample vertical access, take out ofter 5 seconds.
◆ Test result: solder wettability 295%.
Reliable adhesion
◆ After U-8820 PERC silver paster printed and fired, weld ribbon to silver paste, tearing test with 180°temperature, pull force ≥3N.
◆ Aging 2h under 150 °C temperature, pull force ≥ 2N.
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