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PERC Silver Paste

Category:

Silver paste


N-1566 main grid front silver paste suits for polycrystal and monocrystal silicon material, with the characteristics of good printing, low wet weight, good thermal ageing, reliable weldability and high adhesion, good compatibility with market mainstream fine grid lines, and wide co firing window. Low resistance match with mainstream fine grid lines.
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Product Details


N-1566 main grid front silver paste suits for polycrystal and monocrystal silicon material, with the characteristics of good printing, low wet weight, good thermal ageing, reliable weldability and high adhesion, good compatibility with market mainstream fine grid lines, and wide co firing window. Low resistance match with mainstream fine grid lines.

 

Advantages

◆ Low wet weight, smal consumption

◆ Good wettability and solder wettability, suitable for all kinds of ribbon 

◆ High adhesion, Firmly bonding with back side silicon nitride and non-corroding passivation layer.

◆ Good thermal aging performance (oven aging 1h under 150°C temperature,pull> 2N)

◆ Low contact resistance (Low resistance match with mainstream fine grid lines.)

◆ High efficiency

 

Low wet weight

23

◆ Used for 1 56mmx156mm monocrystalline silicon wafer,N-1566 main grid front silver paste can save 2%~5% paste for customers.

 

Good weldability

23

 

◆ Test conditions: solder with 63 sn37pb temperature 240°C, sample vertical access, take out ofter 5 seconds.

◆ Test result: solder wettability ≥95%.

 

Reliable adhesion

◆ After N-1566 main grid front silver paste printed and fired, weld ribbon to silver paste, tearing test with 180° temperature, pull force ≥ 4N.

◆ Aging 2h under 150 °C temperature, pull force ≥ 2N.

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