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Silver paste


ZD-1011 conductive adhesive is used for adhesion of shingled module with fast curing, silver conductive phase and terial and operation cost of the product. ZD-1011 conductive adhesive has the advantages of less tape overflow,high conductivity, high adhesion and rapid curing.
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Product Details


Introduction

ZD-1011 conductive adhesive is used for adhesion of shingled module with fast curing, silver conductive phase and terial and operation cost of the product. ZD-1011 conductive adhesive has the advantages of less tape overflow,high conductivity, high adhesion and rapid curing.

 

Advantages

Long room temperature application time- -when the conductive adhesive is reheated to normal temperature, the application time (gel time) can reach 24 hours, which can reduce the waste caused by downtime.

Excellent dispensing performance - good thixotropy, according to customer needs, can match steel screen printing, screen printing and screw, spray dispensing machine;

Fast curing- - Fast curing in 10-30 seconds at 150-180 °C

Ultra-low Volume Resistivity- The volume resistivity is as low as 3*10-4Ω.cm, which can greatly reduce the series resistance of the shingled module, reduce the package wastage and increase the power of the modules.

 

Viscosity and thixotropy

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